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| ELJFB100KF2资料 | |
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ELJFB100KF2 PDF Download |
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File Size : 116 KB
Manufacturer:PANASONIC Description: The power dissipation of the SOTC23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOTC23 package, PD can be calculated as follows: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：ELJFB100KF2 厂 家：PANASONIC 封 装：08+ 批 号：120000 数 量： 说 明：2520 |
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运 费： 所在地： 新旧程度： |
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| 联系人：蔡先生 柯小姐 |
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